The European Forum for Electronic Components and Systems (EFECS) is Europe’s leading event for innovation, collaboration, and policy in the semiconductor and ECS ecosystem.
This year’s theme — “Accelerate Innovation: Building European Competitiveness” — focuses on how collaboration and technology leadership strengthen Europe’s resilience and sovereignty.
EFECS brings together more than 700 participants from across Europe, including policymakers, researchers, and industry leaders. It’s the place where strategic discussions meet practical innovation, with sessions on AI, quantum, cybersecurity, sustainability, and the Chips Joint Undertaking (Chips JU).
A special satellite workshop on International Cooperation on Semiconductors will highlight key results and ongoing challenges in building economic resilience through global collaboration.
What to Expect:
Insightful presentations: gain a deep understanding of the Chips JU programme and how it addresses Europe’s most pressing technological and economic challenges.
Valuable networking: connect with key stakeholders and the broader ECS community, unlocking new opportunities for collaboration and innovation.
Strategic discussions: engage in high-level discussions focused on reinforcing the EU’s strategic autonomy in electronic components, enhancing technological capacity, and supporting innovation across the entire value chain.
Why attend
Gain insight into Europe’s semiconductor and ECS strategies
Connect with leading experts and decision-makers
Explore funding, partnerships, and collaborative projects
Take part in shaping Europe’s technology future
Organised by:
Participation is open to industry, academia, and policymakers across Europe. Register via the official EFECS website for full details on agenda, sessions, and workshops.
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