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Access to semiconductor pilot lines often begins with many questions. In this blog, Thiago Raddo shares how ChipNL CC helps startups and SMEs find the right path — from understanding the actual need to taking the step towards European Pilot Lines.
In an interview with Brainport Eindhoven, Nick Hol and Rutger Holtzer explain how the ChipNL Competence Centre and the Beethoven program complement each other. Both initiatives work from their own role towards the same broader task: strengthening the Dutch semiconductor sector.
From May 18 to 20, 2026, Czech Semicon Days brought together companies, knowledge institutions, public organizations, and innovation partners in Prague, Brno, and Ústí. The event focused on “Semiconductors for future mobility” and provided space for knowledge sharing, international meetings, and discussions on the development of the semiconductor sector in Europe.
On May 13, 2026, the first Riga Chip Summit took place in Riga: the first chip-specific event in Latvia, organized by the Latvian Chip Competence Centre (LCCC). The summit brought together companies, research institutions, Chip Competence Centres, startups, SMEs and investors from the Nordic-Baltic region and the broader European semiconductor ecosystem.
For startups, scale-ups, and SMEs, the European semiconductor ecosystem offers many opportunities. Think of access to pilot lines, specialized facilities, European funding instruments, partner networks, and new markets. At the same time, the landscape is complex and not always easy to navigate.
Een nieuwe arbeidsmarktfactsheet laat zien dat de vraag naar semicon talent in Nederland aanhoudt. In Q1 2026 stonden 644 vacatures open bij 110 organisaties...
Are you working on AI solutions or high-tech innovations and want to scale up within Europe? Then the new IPCEI AI interest survey offers opportunities to join large-scale European collaborative projects.
The Dutch company New Origin will collaborate with research institute imec to further scale up the production of photonic integrated circuits (PICs). The collaboration focuses on developing production processes that allow photonic chips to be produced in an industrial environment.
The European APECS pilot line opens its facilities to companies and research organizations working on advanced chip technologies. Through this open access, organizations can utilize European infrastructure for advanced packaging and heterogeneous integration.
During this online session, you will receive a clear and substantive overview of the technologies currently available within the FAMES Pilot Line
New advanced interconnect PDKs pave the way for high‑density, energy‑efficient chip‑to‑chip integration.
imec has opened a new NanoIC pilot line for sub-2nm systems-on-chip. The facility strengthens European innovation capacity and the development of next-generation chip technology.