Webinar | Austria’s Semiconductor Ecosystem and Opportunities around EBSCON 2026

LocationOnline
OrganisationChipNL CC, AT-C3, Silicon Alps
Date08-04-2026 | 14:00u - 15:30u
EBSCON website image ChipNL CC (1200x600px)

Join the webinar on Wednesday 8 April

During the webinar, we will also inform you about the upcoming trade mission to EBSCON in October 2026. This mission offers participants the opportunity to exchange knowledge and best practices, visit leading companies and R&D facilities, and explore new international collaborations.

Speakers

  • Peter-Jan Hendrikx - ChipNL Competence Centre

  • Gerlinda Gahleitner – Director Western Europe, Austrian Business Agency

  • Michael Leopold – Business Developer and Innovation Manager, Silicon Alps

Austria plays an important role in the European semiconductor landscape, supported by a strong network of companies and research organizations covering the entire microelectronics value chain.

The country has the third-highest R&D intensity within the European Union. Attractive research funding, favorable conditions for companies, and a well-developed research infrastructure contribute to a strong environment for innovation-driven industries such as microelectronics.

Clusters of research institutions and companies are particularly located in Upper Austria, Vienna, Carinthia, and Styria. The regions of Carinthia and Styria are often referred to as the Silicon Alps, a highly specialized industrial ecosystem.

Austria's Niche Leadership

Austria has developed strong positions in various specialized semiconductor fields, including:

  • Micro-electromechanical systems (MEMS) and sensor technology

  • RFID and NFC technologies

  • Power electronics and applications in the automotive and machinery sector

  • Embedded systems in which hardware and software are integrated

  • Photonics research centers and production facilities

Additionally, Austria has strong capabilities in specific semiconductor niches. Austrian companies hold about 90% of the world market for security chips used in passports. Similar figures are around 55% for optical light sensors and about 20% for technologies necessary for the production of energy-efficient chips.

Organised by: